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    Application Notice
    author:管理員   addtime:2010-07-02 17:14:31.000   hits:7443

    Application Notice
     

    (1) FORMING:   
        1.Please don't form the LED after soldering.If forming is necessary,it must be done before soldering.   
        2.Any unsuitable stress applied to the epoxy body may break bonding wires in LED.   
        3.The minimum distance for the place to bend the lead frame is 2mm from the base of resin.  
    (2) SOLDERING:   
        1.Soldering Bath -260℃±5℃ within 5 seconds.  
    Soldering Iron- Under 30W within3 seconds.(1.6mm from epoxy body)   
        2.Don't apply any force or mechanical stress onto the leads or epoxy body during soldering heat is remained.   
        3.If one line of LEDs are soldered by using a soldering iron,don't solder the leads of the LED at the same time.   
        4.It needs three minutes to cool down to normal room temperature.  
    (3) CLEANING:    
        1.Use alcohol,freon TE or chlorosen to clean LED at normal temperature for less than 1 minute.   
        2.Don't use unspecified chemical liquid because it may cause crack or haze on the surface of the epoxy body.  
    (4) PREVENTING OVER CURRENT:   
        1.In order to operate LED in stable condition,please put protective resistors less series.   
        2.Resistor value can be determined by the formula   
            R=(Vs-VF)/ IF           Where Vs=Source Voltage   
                                            VF=Forward Voltage of LED   
                                            IF=Recommended Current of LED(10~20mA)  
    (5) BRIGHTNESS:   
        1.For the purpose of obtaining uniform brightness,LEDs shall be kept at the same current.   
        2.It is useful for uniform brightness if you use larger sauce voltage and protective resistor.

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